windwithme’s Core i7 review Part 8 - GIGABYTE EX58-UD3R Entry Version

Intel Core i7 has been launching for awhile and the boards are more and more in the market.
However, there is still only one chipset X58+ICH10R which position in high end market.
Since the beginning, all MB makers launched many high end X58 boards and around 300USD. Till now, you can see more mid-range and entry X58 boards.

GIGABYTE provides many models for X58 product line.
There are EXTREME/UD5/UD4/UD3P which total are 7 models.
The price of EXTREME is around 300UDS, UD5/UD4 are around 240~270 USD and entry UD3 series is around 200~220USD.
As per the high end chipset, the price is about 200~300USD. The middle to low is still P4 series.

EX58-UD3R is GIGABYTE X58 most entry model.
Let’s look UD3R body first. It’s also use exclusive Ultra Durable 3 technology.
Full Japanese made solid capacitors、2oz copper PCB.

Left Lower Corner
2 X PCI-E X16( Supports SLI/CrossFireX Technology)
1 X PCIE X4
2 X PCIE X1
2 X PCI
Realtek 8111D is LAN chip.
Realtek ALC888 supports 7.1 channel and High Definition Audio
PCB is MADE IN TAIWAN

Right Lower Corner
6 X SATAII( provide by ICH10R)，support RAID 0， RAID 1， RAID 5 and RAID 10
2 X SATAII，support RAID 0， RAID 1 and JBOD
1 X IDE
Dual BIOS provides dual protection

Right Upper Corner
4 X DIMM DDR3，supports 800/1066/1333/1600/1867/2133/2400，2133/2400 are special spec.
Not same as the other X58 supports 6 DIMM, the UD3R support 1 set 3-channel and 1 DIMM, total is only 4-DIMM.
The max DDR3 capacity is 16GB.

CPU VRM is 4+4 phase and support DES advanced.
The latest VRD11.1 which combine with Intel i7 CPU can support Intel energy saving technology.

IO Part
6 X USB 2.0
1 X RJ-45 LAN
1 X S/PDIF fiber/coaxial output
1 X 1394a

Heat-pipe thermal module
It’s with special courting which avoid oxidation. The black color is also more elegant.

The diagram for installing 3Channel DDR3

 

[windwithme]

Boot Screen

Main Setup Menu

CPU Vcore 0.5000~1.90000V(gap 0.01250V)
QPI/VTT Voltage 1.075~1.495V(gap 0.020V)
IOH Core 1.000~2.000V(gap 0.020V)
DARM Voltage 1.300~2.600V(gap 0.020V)

CPU Features

Clock Control

PC Health Status

GIGABYTE BIOS is more user-friendly. Basically, you only need to adjust clock and voltage. Uncore Frequency Auto can set to DDR3 X2 clock.
This result is stable at CPU/DRAM 197/1970. If you have same equipments or OC requirement, you can refer to this set up.
Configuraiton
CPU: Intel Core i7 950
MB: GIGABYTE EX58-UD3R
DRAM: CORSAIR Dominator 2GBX3 DDR3 1866C9D
VGA: Lantic NGTS250D3-512B2DH
HD: Intel X25-M 80GB
POWER: Corsair HX520W Modular Power Supply
Cooler: Megahalems

DRAM
CORSAIR Dominator 2GBX3 DDR3 1866C9D
Official spec is DDR3 1866 CL9 9-9-24 1.65V

DDR3 1865 CL8 8-8-24 1T，1.66V
SP2004 3 X Blend mode，5.78GB stable at full load.

DDR3 1865 CL8 8-8-24 1T
Sandra Memory Bandwidth-31911MB/s
EVEREST Memory Read-19425MB/s

DDR3 1970 CL9 9-9-24 1T，168V
SP2004 3 X Blend mode，5.83GB stable at full load.

 

[windwithme]

DDR3 1970 CL9 9-9-24 1T
Sandra Memory Bandwidth-33540MB/s
EVEREST Memory Read-20751MB/s

DDR3 2064 CL9 9-9-24 1T
EVEREST Memory Read-25132MB/s

As UD3R BIOS VTT voltage only supports to 1.495V, so it limits the stable clock.
Nevertheless, the stable sync at 197/1970 is also the high standard.
As running at DDR3 2064, the EVEREST reaches the extreme high bandwidth.
CPU
Intel Core i7 950 D0 OC 197X21=>4137Mhz
DDR3 1970 CL9 9-9-24 1T

CrystalMark 2004R3

CINEBENCH R10

197/1970
Hyper PI 8 X 32M，HT Enable

Stable frequency limitation 211X20=>4220Mhz

As CPU OC, you can over 4.2G which with latest Core i7 950 D0.
If you only raise the clock, you can pass Hyper SuperPI 32M in 211Mhz.
3D
Using Nvidia GTS250 and also compare GTS250 performance with
4870X2、4870、4850、4650、9600GT in Core i7 platform.
Clock 750/1875/2300MHz

3DMARK2006

3DMARKVANTAGE

Crysis Benchmark

Need for Speed Undercover
1920X1200
Anti-Aliasing 4X

GTS250 3D performance is mid-high level. It can support most games for sure.
But in Crysis Benchmark, high quality in 1920X1200 or 4XAA are not good enough.
GIGABYTE EX58-UD3R Conclusion
Good
1.UD3R also use GIGABYTE 2oz PCB and Ultra Durable3 components
2. Full Japanese made solid capacitors，Good quality heat-pipe thermal module
3.BIOS supports wide range voltage and frequency
4.CPU frequency and DDR3 clock are good OC ability，Support both SLI/CFX
5.4+4 phase DES Advanced，Intel latest VRD11.1

Weakness
1. LGA 1366 is still high price platform
2.DDR3 6 DIMM is better for expansion.

Performance ★★★★★★★★☆☆
Components ★★★★★★★☆☆☆
Outlook ★★★★★★★★☆☆
C/P Value ★★★★★★★★★☆

The evaluation is comparing with all X58 products.
For the components, if you compare with P45 or X48, you can see X58 boards are better.
If you compare to P35、P45、X48、X58, even entry EX58-UD3R also can be over 8-star level.

C/P Value is also comparing to X58 series.
If compare to Intel full series, X58 is the high end product, then the C/P value will be less than 9-star.
So I am used to use the same level and series products as the evaluation standard. Otherwise, it’s unfair.

EX58-UD3R and EX58-UD3R-SLI difference is SLI support, but the latest F5 BIOS also make EX58-UD3R support Nvidia SLI technology.
It’s also a value added feature for SLI users.

In current X58 product line, the entry model is around 200USD.
GIGABYTE EX58-UD3R in this segment has very high C/P value.
Except the 4 DIMM design, the components and OC ability are absolutely have 200USD product level.

Intel middle to entry is still occupied by LGA 775, so the users who interested in LGA 1366 might think the price is too high.
In late 2009, Intel will launch mid range LGA 1156 Core i5 series, you will find more clear product position.
I think LGA 1366 position in high end product won’t be changed in 1 year.
If you are interested in Core i7 platform and you are budget limited, you can try 200USD entry X58 board.

 

[Rockfella]

Thanks Sir, Keep posting more n more good reviews in TE