After AMD, Intel, Tessolve will set up 3 chip units

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shirish

Forerunner
HYDERABAD: Tessolve Services, a US-based semiconductor test and manufacturing services company has finalised plans to invest upwards of Rs 1,000 crore to build assembly and test facilities for semiconductor in India over the next four years.

The San Jose, California-based company that does most of its development work in Bangalore has zeroed in Hyderabad for most of the investment with a proposal to set up a 300,000 sft production area at the upcoming FabCity complex.

This will be the second assembly-test-mark-pack (ATMP) unit that will come up at the FabCity, where promoter SemIndia itself will also set up a similar unit.

While a fabrication unit rolls out raw silicon wafers, an ATMP will assemble, test, mark (print details on the chip) and shrinkwrap them. Say if it’s a personal computer processor, then we are talking about a cluster of chips that the ATMP will sort and pack.

Talks are on with SemIndia Inc, which is anchoring the ambitious FabCity project, for setting up the semiconductor packaging facility that will provide direct employment to between 1,200-1,300 people, Raja Manickam, co-founder and CEO, Tessolve told DNA Money.

Tessolve will also set up a smaller sized ATMP in Chennai where most of the testing work will be carried out, he added.

The Chennai facility will employ 300 people.

But much before these two facilities come up, a $20mn prototype facility will be up and running in Bangalore by September with a capacity to roll out up to four million units per month.
 
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