Apple unleashed the iPhone on the general public only hours ago and it has already been dissected. With a heat gun and razor blade, tech guru Anand Lal Shimpi was able to strip the Apple iPhone of its brushed aluminum cover and reveal its innards. Inside the iPhone, there are the usual GSM and WiFi antennas, battery, camera and tape.
Apple makes use of two PCBs in a sandwich configuration – each tightly packed with chips. Apple equips the iPhone with Samsung MLC NAND flash memory and an ARM processor. The ARM processor was manufacture by Samsung, but has an Apple logo printed on it. AnandTech believes the Apple branded ARM processor may be the Samsung S3C6400 derived from an ARM1176 core.
The iPhone’s multi-touch screen consists of multiple layers. On the layer closest to the motherboard, Apple lays down faint dots in a grid-like pattern. The dot grid is necessary for the multi-touch screen, apparently.
After dissection, AnandTech was unable to get the phone to function again. Shimpi warns, "While it is quite possible to take apart using easy to find tools we'd recommend against it as it will undoubtedly void your warranty and will most likely mar up the beautiful gadget's exterior."
Complete stuff:
AnandTech: Apple's iPhone Dissected: We did it, so you don't have to