Hi
I am trying to install the Antec H2O 920 in my system with mobo Asus P8Pp67 pro but the [FONT=inherit !important][FONT=inherit !important]adhesive[/FONT][/FONT] foam in plastic backplate is covering come solder joints in the motherboard.Is this normal or should I revert back to stock heatsink.
Though the backplate is of plastic ,and there is no question of solder joints getting short,but I am afraid the adhesive might come down out of heat and may cause problems.
Please guide.
I am trying to install the Antec H2O 920 in my system with mobo Asus P8Pp67 pro but the [FONT=inherit !important][FONT=inherit !important]adhesive[/FONT][/FONT] foam in plastic backplate is covering come solder joints in the motherboard.Is this normal or should I revert back to stock heatsink.
Though the backplate is of plastic ,and there is no question of solder joints getting short,but I am afraid the adhesive might come down out of heat and may cause problems.
Please guide.