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Intel 2013 Haswell CPUs Get Detailed in Series of Leaked Slides
Source : http://news.softpedi...es-233364.shtml
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Intel Haswell CPUs to Launch in Mar-Jun 2013, Says Leaked Company Roadmap
Source : http://news.softpedi...ap-251787.shtml
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Intel Haswell CPUs Could Pack Multiple GPU Cores
Source : http://news.softpedi...es-227894.shtml
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Intel LGA 1150 Socket Will Be Compatible with 2014 Broadwell CPUs - Report
Source : http://www.softpedia...ew-252467.shtml
Source : http://news.softpedi...es-233364.shtml
Now that Ivy Bridge has entered volume manufacturing, Intel has turned its attention towards its next-generation architecture code named Haswell, which was just detailed in a couple of leaked slides together with the Lynx Point chipset.
Haswell will be a “Tock†on the chip maker's roadmap meaning that it uses an entirely new architecture built using the 22nm production node.
The first chips using this new core are expected to land in 2013 and according to the slides published by Chiphell, Intel plans to split its product range into two distinct groups.
The first group includes the company's desktop and notebook processors, while the latter is specially designed for Ultrabooks and drops the usual 2-chip platform approach that Intel has been using for quite some time in favor of a system-on-a-chip (SoC) design.
Desktop CPUs will feature either two of four processing cores with TDPs of 35, 45, 65 or 95 Watt, and will include a dual-channel DDR3/DDR3L memory controller as well as GT2 or GT1 integrated graphics cores.
Mobile chips will be available in the same dual or quad-core configurations, but the memory controller only supports DDR3L DIMMs and get the more powerful Intel GT3 GPU.
As far as the Ultrabooks Haswell chips are concerned, these will be limited at supporting dual computing cores.
The TDP of Intel's upcoming system-on-a-chip devices will be set at 15W, while the rest of the notebook processors are rated as 37, 47 or 57 Watt parts.
Other features include support for the DirectX 11.1 API, support for the AVX2 instruction set as well as a series of IPC improvements meant to increase single-thread performance.
In addition, mobile Haswell processors will also include a configurable TDP technology that enables the CPU to greatly surpass its maximum thermal design power in order to increase its performance when additional cooling is provided (like when used together with an external cooling dock).
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Intel Haswell CPUs to Launch in Mar-Jun 2013, Says Leaked Company Roadmap
Source : http://news.softpedi...ap-251787.shtml
The launch date of Intel’s 2012 Haswell processors has so far been covered in mystery, but recently a leaked company roadmap has revealed that these chips are expected to arrive in the March-June timeframe.
Just as it’s the case with the upcoming Ivy Bridge launch, the first CPUs to arrive will be introduced in the Core i5 and Core i7 product lines.
These will cover the mainstream and performance sector, while the lower end Core i3 processors are expected to be launched later that year, according to the info leaked by Donanim Haber.
Haswell will be a “Tock†on Intel’s roadmap, meaning that it has an entirely new architecture built using the 22nm production node.
Intel plans to split its product range into two distinct groups. The first group includes the company's desktop and notebook processors, while the latter is specially designed for Ultrabooks and drops the usual 2-chip platform approach that Intel has been using for quite some time in favor of a system-on-a-chip (SoC) design.
Desktop CPUs will feature either two of four processing cores with TDPs of 35, 45, 65 or 95 Watt, and will include a dual-channel DDR3/DDR3L memory controller, as well as GT2 or GT1 integrated graphics cores.
Mobile chips will be available in the same dual or quad-core configurations, but feature the more powerful Intel GT3 GPU, while the memory controller only supports DDR3L DIMMs.
As far as the Ultrabooks Haswell chips are concerned, these will be limited at supporting dual computing cores.
The TDP of Intel's upcoming system-on-a-chip devices will be set at 15W, while the rest of the notebook processors are rated as 37, 47 or 57 Watt parts..
Other features include support for the DirectX 11.1 API, support for the AVX2 instruction set, as well as a series of IPC improvements meant to increase single-thread performance. More details should become available in the coming months, after Intel starts the distribution of the first engineering sample CPUs.
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Intel Haswell CPUs Could Pack Multiple GPU Cores
Source : http://news.softpedi...es-227894.shtml
In 2013 Intel will introduce a new processor architecture known under the code-name of Haswell and a recent report has come to suggest that chips built using this new technology could include more than one graphics cores.
According to an unnamed source cited by VR-Zone, Intel believes that such an approach would enable it to create more flexible processors that could cater to the needs of both the mobile and the desktop market.
Details about how these GPUs will be interconnected with eachother and about the specific configurations used are scarce at this time, but the Website suggests Intel's processors could pair 4 CPU cores with 2 GPU cores or even dual computing cores with three graphics cores to form a chip.
Intel's Haswell processors will come as the successors of Ivy Bridge and use a new architecture which the chip maker has fine tuned to reach TDPs between 10 and 20 Watts in their mobile version.
This is a significant departure from the current regular-voltage Sandy Bridge chips that are rated at 35 to 45 Watts.
The low power draw, together with the configurable TDP technology that will debut in Ivy Bridge, is expected to enable laptop makers to offer up to 10 days of connected standby battery life from their Haswell-based devices.
These will be paired with a new dynamic overclocking technology, that will massively enhance the functionality available in the second version of Turbo Core that is used in today's Sandy Bridge processors.
Other features will include support for the DirectX 11.1 API, support for the AVX2 instruction set as well as a series of IPC improvements meant to increase single-thread performance.
As mentioned a bit earlier, Haswell is expected to arrive in 2013, but a more specific release date hasn't been announced.
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Intel LGA 1150 Socket Will Be Compatible with 2014 Broadwell CPUs - Report
Source : http://www.softpedia...ew-252467.shtml
Intel’s LGA 1150 socket that will be introduced together with next year’s Haswell processors will also be compatible with the company’s upcoming Braodwell CPUs, which are expected to arrive in 2012 fabricated using the 14nm production node.
This information was unveiled by a recently leaked Intel slide that details the company’s 2013 Haswell processors and the Lynx Point chipset accompanying it.
According to this slide, the LGA 1150 socket that Intel plans to introduce at the same time with the successor of Ivy Bridge will also be compatible with the company’s 2014 desktop CPUs.
Even though most of us expected this to be the case, it’s nice to see a confirmation from Intel’s part.
The slide leaked by Donanim Haber also gives us some info about Intel’s Lynx Point chipset, which pretty much packs the same features as the 7-series platform controller hubs (PCHs) for Ivy Bridge CPUs, but adds a Clarkville NIC.
For those of you that aren’t up to speed with Intel’s processor plans, the Broadwell CPU comes as a "tick" on the chip maker’s roadmap, meaning that this is actually a 14nm die shrink of the Haswell architecture.
Compared to its predecessor, Broadwell will however use a more integrated design which includes features such as Ethernet, Thunderbolt or USB 3.0 right on the chip’s die.
Right now, little else is known about Broadwell, but since it comes as a die shrink of Haswell, many of the architecture changes and features introduced by Intel in the latter will make their transition towards this 2014 CPU.
Some of the most important changes will target the processor’s IPC performance, but a series of new instruction sets like AVX2 and TSX are also expected to make their appearance.