Re: ur temps,
it seems ur m/b sensors are "reading" low voltages. anyways to confirm it use a digital multimeter.
Re: AS5: i always repeat the procedure two or three times to get it right.
a) first apply a small quantity on the base of the heatsink. enough to cover the area which will be in contact with the core of the cpu. spread it thinly. this is to cover / fill the microscopic pits on the surface of the h/s.
b) apply a small bit of as5 in the centere of the core of the cpu. do not spread it.
c) fit the h/s properly. the weight and pressure of the heatsink will spread the AS5, which was on the core, nicely and evenly, then i twist the h/s lightly in both directions to release any air which might be trapped in between them.
d) Then keeping the m/b in the horizontal position , i.e. laying the tower case on its sides (Gravity helps), i switch on the m/c and run prime for about half an hour. this heats up the AS5 and spreads it properly. Then switch off the m/c for about 15 minutes to cool off AS5.
Then repeat the procedure of running prime for 30 minutes and switching off.
e) Then i remove the heatsink , with a tissue paper "only" i lightly remove the AS5 from the surface of the heatsink , leaving enough so that the dark gray colour of the AS5 is visible. Then apply a fresh coat of AS5 on the heat sink and spead it thinly as before.
on the cpu the second time i use nail polish remover to completely clean the cpu surface and put fresh AS5 on the centre of the cpu core. (At the centre the max heat is radiated / Transferred). lay the h/s on the cpu and twist it both sides to release any trapped air etc....
Then run the m/c for about a day in with the case in a horizontal position, to spead the AS5 evenly.
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The above is the procedure i use normally for "my" m/c's. if needed i repeat the procedure multiple times till i get it right.
the main things to remember is this, "There should be no air between the h/s and cpu. Since air is a very good insulator it will restrict the heat transfer."
The thermal compound should be as thin as possible. enough to fill in the microspic pits and remove any air between the h/s and the cpu. actually AS5 (or any thermal compound) replaces this trapped air. replacing the heat insulator (air) with heat conductor (silver and other metal particles)
second thing to remember is that it takes about 15 ~ 30 days of frequent switching on / off of the m/c (Thermal cycling) for the AS5 to give optimum results. over a period of time you will notice a slight drop in temps ( a few "C"'s), provided other factors such as keeping the h/s and fan clean of clogged dirt are religiosly followed.
and yes on "AIR" cooling the ambient / room temps play a very important role.actually once you know the temperature differece between the cpu temps on idle load and the ambient / room temps. then you can make a fairly good judgement of the room temps just by reading the cpu temps on idle load. They scale proportionately.
