DarkAngel
Herald
Intel is set to announce a change of heart at its IDF in just a few weeks time, as it will instead adopt USB 3 in its upcoming Sandy Bridge chipsets.
It appears to be a last minute change due to industry pressure from AMD, which will have USB 3 in its upcoming Fuzion chipsets, thanks to a cooperation with Renesas - the maker of all NEC-branded USB 3 chips used on motherboards to date.
Many motherboard manufacturers already have board designs including third-party NEC and possibly VIA USB 3 chipsets, claims the report in Chinatimes (via Yahoo news in Taiwan, so grab a translator), so these companies will have to decide whether they have time to redesign their motherboards to use the integrated USB3 from Intel's chipset instead.
So far, the report states the change affects Intel 'Cougar Point' chipsets, but it is currently not more specific in terms of which chipsets have changed and how many ports are being provided.
To date Intel has previously been betting on its Light Peak technology as a faster alternative to USB 3, however that's still a way off and the weight of industry adoption already behind USB 3 is claimed to have caused the turn around in attitude.
Intel is set next week in the fall Developer Forum held in the United States (IDF) next-generation 32-nanometer processors enshrined in Sandy Bridge, will be announced in the Sandy Bridge motherboard reference design (reference design), the formal independence of the host side into the USB 3.0 ( host) controller. Corporation said the move will accelerate the popularity of USB 3.0, and Faraday (3035), Chong Wei (6104), Wang Jiu (6233), etc. in terms of industry would be a boon.
IDF Intel's annual gala will be held next week in San Francisco, this year's main event is to take the new structure of 32 nm processors Sandy Bridge, will be advanced to production in Q4 cast film, and was to ship in Q1 next year.
AlthoughIntelis not in the Sandy Bridge carrying the Cougar Point chipset, the original built-in USB 3.0 Host Controller, but rival Advanced Micro USB 3.0 layout has been in full swing, so Sandy Bridge reference design directly into the motherboard USB 3.0.
AMD is currently leading Intel USB 3.0 layout, including Season 2 will be launched next year, code-named Llano's new four-core processor speed (APU), also introduced native built-in USB 3.0 Host Controller Hudson-D2, Hudson -M3 chipset; The group had no support other chips, but AMD has been with Renesas Electronics (Renesas) cooperation will Renesas USB 3.0 into their motherboard reference designs. That is, after next year's Q2, AMD will support all computer platforms USB 3.0.
Intel originally intended to promote the fiber-optic communication transmission interface for the Light Peak mainstream, but the new standard for promotion, Intel shifted attention to the potential business opportunities for USB 3.0, in addition to already announced the Light Peak connector with USB 3.0 compatible motherboard industry rumors, Intel will follow the example of AMD and Renesas model of collaboration, in Sandy Bridge motherboard reference design by adding USB 3.0 Host Controller, is now in the final debugging work.
Motherboard industry, who said to include reference design uses a USB 3.0 is still independent host-side controllers, your client will decide whether to support, but less than the current controller Jiage Yi 3U.S. dollarscircumstances Lai Kan, almost all motherboards are Keque Ding will join the USB 3.0 functionality, which will drive USB 3.0 Host controller chip sales, on the Renesas, Faraday, Yu Chong, Wei Feng and other businesses will be profitable.
Intel and Advanced Micro Devices, after the full import USB 3.0 interface, including flash drives, external hard drive, Blu-ray disc players and other storage devices, USB 3.0 will be fully shifted from generation to generation, and fully detonating device side (device) USB 3.0 control chip sales , including Genesys, Wang Jiu, Yasukuni and other industry, 4 quarter are receiving module or hard disk Works plant and began shipping orders, USB 3.0 market has officially entered the explosive growth stage identified.
Source: Intel backtracks on USB 3 | bit-tech.net
China Times
Now hope to see faster and cheaper external storage devices take over the market in the next year
