[SPCR] : Lapping, HSF & CPU heatspreader profile, etc.
- Thread starter PoBoy
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About 8 years behind time. Lapping of CPU and sometimes heatsink bases were used regularly in the old days of Thunderbird and later, Barton. 2005-2006. All the fine grades of paper would be purchased from lohar chawl, and a mirror was used as a sanding block.
SPCR catches on to this stuff fairly slow. We were discussing manufacturing processes of Intel spreaders, which are indeed concave on one specific direction, about five years ago in the C2D era. Also, I don't really agree with the concept of using software and an OS as a testing method, far too inconsistent from run to run depending on background processes etc. A constant, regulated heat load may represent reality in a worse way, t is a better tool for comparison.
When it comes to sound levels and silence though, they are kings of the hill.
SPCR catches on to this stuff fairly slow. We were discussing manufacturing processes of Intel spreaders, which are indeed concave on one specific direction, about five years ago in the C2D era. Also, I don't really agree with the concept of using software and an OS as a testing method, far too inconsistent from run to run depending on background processes etc. A constant, regulated heat load may represent reality in a worse way, t is a better tool for comparison.
When it comes to sound levels and silence though, they are kings of the hill.
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