Best method to apply Arctic Cooling MX-2

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Spectre

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for a HDT cooler

Folks who have used MX-2 earlier, specially with HDT cooler or have knowledge on the same, please suggest :)

I am still a n00b with the TIM application techniques and screw it up most times :ashamed:
Will be getting MX-2 soon from Itwares and will use it with CM Hyper 212+
proccy is C2D - E8400

Any pointers will help a lot, TIA

Spectre
 
Well there are many school of thought regarding this. So 'before hand' this is my preferred method. Not the exact right method.

I clean both surface(s) (if not brand new) with a lightly lint free cloth lightly dampened with isopropyl alcohol. Let it dry for a few minutes. Put a few drop of TIM on the CPU header. Wrap a thin plastic around my index finger, and spread it evenly. And mount the HSF.
 
i use a hard film type material to spread it evenly, to make a uniform thin coat over the proccy.

an Xray film piece cud do the job well.
 
It just should be evenly spread out/and fill the air gaps between the HSF/CPU header, since they will never 100% exact align. If really have time and extra TIM, you can try all the suggested methods:

Apply the TIM,mount the HSF, leave it for a few minutes, and then remove it, and inspect the HSF contact surface for TIM spread.
 
Just got the MX2 yesterday.

I spread it with my forefinger wrapped in a plastic bag. Works best for me.

Also check out the official instructions from arctic cooling site

Arctic Cooling
 
You can use a latex gloves and spread with finger. Make sure you clean the HS and CPU with isopropryl. The benefit is it dries fast and leaves no residue.
 
asingh said:
It just should be evenly spread out/and fill the air gaps between the HSF/CPU header, since they will never 100% exact align. If really have time and extra TIM, you can try all the suggested methods:

Apply the TIM,mount the HSF, leave it for a few minutes, and then remove it, and inspect the HSF contact surface for TIM spread.
Click to expand...

Woudnt removing the HSF and again putting it back, allow the presence of air bubbles/uneven spread when the HSF is placed back again?

If so, then why not just check for any excess/overflow around the edges and wipe it clean. Personally, I wouldn't open the contraption once its held properly.
 
^^

Actually the HSF/CPU contact surface is open -- i.e. it is not a closed tube of pipe, where air bubbles can get trapped inside (like a syringe). Imagine it like this. You put both your palms together. Now they are touching each other, but are both palm surface 100% in contact. There would be some gaps (very small and minute) between the two palms. So to fill those small, tiny gaps the TIM is placed in between. So heat from the CPU can directly escape to the HSF.

How could you check for excess/overflow around the edges. Not possible, since the HSF will cover the contact area, and visible area around it. So to remove any possibility of doubt since inspection is not possible TIM is applied. Many open the HSF periodically, to reapply TIM, since it dries out and hardens. I do it once every 6 months. Its like putting new grease in a car....!
 
i put the grain size amount of paste on the ihs of the chip, keep the cooler above it n let the pressure fill the irregularity in surface than spreading it even myself.

work well for me and there is no wastage.

i have faced wastage while using the plastic finger or any surface to spread the paste.
 
Wow, so many suggestions, thanks guys :)

1 more query, should we apply a TIM on HDT surface as well or just on the CPU and press them with the cooler
 
Since your cooler is an HDT based model, I suggest not to go with the rice-grain method. That's insufficient for the HDT based cooler - I've had a Xigmatek S1283 quite a while back and I've experienced this.

Instead, apply the TIM on the gap between the heatpipes on the base of the cooler in a straight line. This would ensure the TIM is spread to the adjacent sides of the heatpipes.

A HDT based cooler requires a slightly higher quantity of TIM compared to the NI-plated base of other coolers.

Refer the last 2 photos!
 
Thanks Gannu :), saw that

you mean to say, i should apply two-lines only on HDT cooler and press it against the CPU(with no TIM on it)

Gannu said:
Since your cooler is an HDT based model, I suggest not to go with the rice-grain method. That's insufficient for the HDT based cooler - I've had a Xigmatek S1283 quite a while back and I've experienced this.

Instead, apply the TIM on the gap between the heatpipes on the base of the cooler in a straight line. This would ensure the TIM is spread to the adjacent sides of the heatpipes.

A HDT based cooler requires a slightly higher quantity of TIM compared to the NI-plated base of other coolers.

Refer the last 2 photos!
Click to expand...
 
^Yeah. That works out better than dropping the poop on the CPU IHS - not at least in this case when you have a HDT based cooler.

Not limited to 2 lines but (n-1) where n is the no. of heatpipes that runs across the heatsink. I think its 2 for CM212. Some HDT based coolers have 4 heatpipes. In any case, even if a little amount comes out, it's safe - it wouldn't overflow and touch your circuitry and cause it to short it! :P
 
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