Thermal Compound is must for all CPUs, GPU, chipsets. Every electronic component which generate a lot of heat and requirs a HEATSINK to transfer heat, must have a fine layer of thermal component in between chip and heatsink.
In-proper appling of thermal component ie a thick layer, not evenly spread over the surface, having gaps or air in it, will lead to increase the temperature of chip.
In-proper appling of thermal component ie a thick layer, not evenly spread over the surface, having gaps or air in it, will lead to increase the temperature of chip.