Reason Behind Ivy Bridge's High Temperatures - TIM Used Instead of Solder
The temperatures of Ivy Bridge CPUs being higher than Sandy Bridge is noted in most reviews and tests . Ivy Bridge CPUs run upto 20°C hotter compared to Sandy Bridge chips when overclocked.
While many people think that the reason behind this is power density being greater on Ivy Bridge , and some say that Intel is having problems with tri-gate / 22nm tech .
Its right that power density is higher , but that doesn't account for the temperatures being 20°C higher .
According to overclockers.com - the reason behind the high temperatures lies under the IHS of the chips .
Intel is using TIM paste between the CPU die and Integrated Heat Spreader , instead of fluxless solder used in previous gen chips . The heat conductivity of TIM is in range of 5W/mK whereas solder has heat conductivity in range of 80 W/mK . This is the reason which decreases the effective heat transfer between CPU die and IHS .
Why Intel is using TIM instead of solder is not sure , or if it will be seen only in Engineering samples or final units as well .
However, there is an advantage in this also , if the IHS of these chips is removed then there is less much less risk of damaging the die , which could help extreme overclockers to get better temperatures for improved overclocking.
Source
The temperatures of Ivy Bridge CPUs being higher than Sandy Bridge is noted in most reviews and tests . Ivy Bridge CPUs run upto 20°C hotter compared to Sandy Bridge chips when overclocked.
While many people think that the reason behind this is power density being greater on Ivy Bridge , and some say that Intel is having problems with tri-gate / 22nm tech .
Its right that power density is higher , but that doesn't account for the temperatures being 20°C higher .
According to overclockers.com - the reason behind the high temperatures lies under the IHS of the chips .
Intel is using TIM paste between the CPU die and Integrated Heat Spreader , instead of fluxless solder used in previous gen chips . The heat conductivity of TIM is in range of 5W/mK whereas solder has heat conductivity in range of 80 W/mK . This is the reason which decreases the effective heat transfer between CPU die and IHS .
Why Intel is using TIM instead of solder is not sure , or if it will be seen only in Engineering samples or final units as well .
However, there is an advantage in this also , if the IHS of these chips is removed then there is less much less risk of damaging the die , which could help extreme overclockers to get better temperatures for improved overclocking.
Source