Hello everyone...
Not gonna jazz it up... so lets get to details about those amazing chips from AMD which have lowered the TDP to 125W for 965 BE.
Setup:
AMD P II 965 *C3*
Gigabyte MA790FXT-UD5P [F6H]
ASUS GTX295
Kingston HyperX 1800 CL9 2GB kit
Silverstone DA1000
7200.10 250GB
Dell 24"
Note: I am still learning to bench with AMD
Max Validation as of now!
Many thanks to AMD for sending the chip way before release time... it would have been perfect if 5870s were there to play with well when I pushed this superb chip to 6G and beyond.
Hopefully that will happen in near future as well.
Till then you guys be safe and thanks for reading!!:hap2:
Not gonna jazz it up... so lets get to details about those amazing chips from AMD which have lowered the TDP to 125W for 965 BE.
That's all nice but we are here to see the performance so here we go...AMD said:New Phenom II X4 965 processor:
On October 19th, a new revision of the 3.4GHz Phenom II X4 965 Black Edition will become available. The new revision will not have major changes. Most specifications and raw performance will remain the same; however, there are 3 noteworthy improvements.
· TDP = 125W (down from 140W)
· Hardware C1E implemented (faster switching of power states means virtually no impact to performance by power management when BIOS support is properly implemented)
· “Heavy†load support for DDR3-1333 (with proper BIOS implementation, memory controller will now support up to 4x DDR3 DIMMs at 1333MHz)
New Phenom II Processor Specifications:
Model Number & Core Frequency: X4 965 / 3.4GHz (Black Edition)
OPN: HDZ965FBK4DGM ß“M†indicates new revision
L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
L2 Cache Sizes: 512KB of L2 data cache per core (2MB total L2 per processor)
L3 Cache Size: 6MB (shared)
Total Cache (L2+L3): 8MB
Memory Controller Type: Integrated 128-bit wide memory controller *
Memory Controller Speed: Up to 2.0GHz with Dual Dynamic Power Management
Types of Memory Supported: Unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor-to-System Bandwidth: Up to 37.3GB/s total bandwidth [Up to 21.3 GB/s memory bandwidth (DDR3-1333) + 16.0GB/s (HT3)]
Up to 33.1GB/s total bandwidth [Up to 17.1 GB/s memory bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location: GLOBALFOUNDARIES Fab 1 module 1 in Dresden, Germany (formerly AMD Fab 36)
Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die Size: 258mm2
Approximate Transistor count: ~758 million
Max Temp: 62o Celsius
Nominal Voltage: 0.825-1.4V
Max TDP: 125 Watts
*Note: configurable for dual 64-bit channels for simultaneous read/writes
Cool & Quiet on Windows 7:
Please ensure that Cool’n’Quiet is functional during power consumption testing to replicate true consumer experience “at the plug.†Enabling Cool’n’Quiet on Windows 7 is the same as it is on Windows Vista…
Setup:
AMD P II 965 *C3*
Gigabyte MA790FXT-UD5P [F6H]
ASUS GTX295
Kingston HyperX 1800 CL9 2GB kit
Silverstone DA1000
7200.10 250GB
Dell 24"
Note: I am still learning to bench with AMD











Max Validation as of now!
Many thanks to AMD for sending the chip way before release time... it would have been perfect if 5870s were there to play with well when I pushed this superb chip to 6G and beyond.
Hopefully that will happen in near future as well.
Till then you guys be safe and thanks for reading!!:hap2: