n the weeks to come Intel and its partners, would be buzzing with activity, in the form of product launches. Three models of the Core i7 series processors, accompanied by supportive motherboards, and possibly tri-channel DDR3 memory kits, would kit shelves. The LGA-1366 socket would serve as an extreme and performance segment offering, on the whole. The mainstream segment would continue in the form of the newer LGA-1160 socket, and the Ibex Peak platform. Processors would essentially use the same architecture as the upcoming i7 processors, but feature dual-channel memory interfaces, and continue using the DMI front-side bus as the system interface.
As for its supportive chipset, Intel plans to label them under the P5x series. Chipsets without IGPs, would have so little machinery, with the memory controller shifted to the CPU, that even high-performance chipsets could be monolithic. A single chip would handle the system's peripherals, storage, and connect it to the CPU. There are indications that the CPU could house PCI-Express switches on-die. This would provide direct connections between PCI-E devices such as graphics cards, and the CPU. The P5x series chipsets could include a confirmed P55 chipset that rules its roost, with P53 and P51 chipsets that fabricate the lineup.
The P55 chipset could feature:
Socket LGA 1160, supporting Lynnfield (quad-core) and Havendale (dual-core) processors.
PCI-E 2.0 (on the CPU): Supports one graphics card in x16 or two in x8, x8 mode.
Six SATA II ports, with support for RAID 0/1/5/10 modes.
14 USB 2.0 ports.
Gigabit PHY onboard, HD audio interface.
The P55, along with the newer mainstream platform, is slated for later next year. A lot depends on the reception of the flagship Nehalem platform, and of how Intel is able to manage its sales with existing technologies.
